材料系暑期密集短期課程公告

課程名稱：

電子構裝中微接合技術

Micro-joining Technologies for Electronic Packaging

開課教授：大阪大學-西川宏教授

時間：7/27-29，0900-1600，總計18小時

上課地點：E1-306

課程綱要：

The course focuses on micro-joining technologies from materials science perspectives. Fundamental mechanisms, interfacial reactions, micro-structural evolution, mechanical properties, and joint-reliability will be discussed in detailed.

歡迎大家前來修課如有意願修課，請將個人姓名、年級及電子郵件等資訊郵寄至：黃芷琳同學(lynn0911023@gmail.com)以利統計修課人數。

謝謝。

Department of Materials Science and Engineering –

Summer Intensive Short-Term Course Announcement

Course Title: Micro-joining Technologies for Electronic Packaging

Instructor: Professor Hiroshi Nishikawa, Osaka University

Schedule: July 27–29, 09:00–16:00 (total 18 hours)

Classroom: E1-306

Course Outline: The course focuses on micro-joining technologies from materials science perspectives. Fundamental mechanisms, interfacial reactions, microstructural evolution, mechanical properties, and joint reliability will be discussed in detail.

Registration: Students who are interested in taking this course are welcome to join. Please send your name, year of study, and email address to Ms. Lynn Huang (lynn0911023@gmail.com) for enrollment statistics.