Introduction
IS (International Semiconductor Processing and Equipment Engineering Program)
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Characteristic |
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1. With semiconductor manufacturing processes, equipment, and automation technologies as the core, this program integrates diverse learning across the entire industry value chain—upstream, midstream, and downstream—to promote interdisciplinary technical knowledge and its practical application. 2. The program integrates both theoretical and practical components to meet industry demands and bridge the talent gap in the semiconductor industry. 3. The core curriculum is mainly supported by courses from the Departments of Materials Science and Mechanical Engineering, while interdisciplinary learning is enriched through industry-relevant electives provided by other departments within the College of Engineering. 4. Internship and project-based courses are developed in collaboration with the semiconductor industry, with a focus on aligning with current industry demands. |
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Goal |
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1. Dedicated to training foreign talent in the areas of semiconductor processing and equipment to meet global industry demands. 2. Providing international students with opportunities to develop a secondary specialty through interdisciplinary and flexible learning pathways. 3. Offering international talents a pathway to upskill and prepare for careers in the semiconductor sector. |
