跳到主要內容區
:::
  1. 首頁
  2. 最新消息
  3. 系辦公告
【公告】 8/11-14暑期外師短期授課-課程資訊

【公告】 8/11-14暑期外師短期授課-課程資訊

113暑期短期授課

課程名稱：電子構裝中金屬銲錫料應用簡介_   

授課時間：8/11-14，詳細內容時間如附件。

授課地點：E1-306

授課老師：印尼東加里曼丹技術學院-Andromeda Dwi Laksono助理教授

課程綱要：

    本課程綜合概述了金屬材料及其在電子封裝中的應用，重點在於焊料行為。它首先介紹金屬結構、晶體系統和相圖的基礎知識，然後介紹退火、淬火和回火等熱處理技術。然後，課程探討焊料材料，比較含鉛和無鉛系統，以及它們在使用過程中的微觀結構演變。以應用為重點的主題包括焊點可靠性、金屬間化合物的形成以及電子設備中的故障機制。課程以基於無鉛焊料環境中銅合金實驗研究的案例研究作為結束。

歡迎同學踴躍修課！

 

Topic: Introduction of Solder Materials in Electronic Packaging

Date

Time

Content

Marker

8/11

10.20-11.10

Atomic Structure & Bonding

  • Metallic bonding models (free-electron, nearly-free)
  • Crystal lattices and unit cells

Presentation & Discussion

11.20-12.10

Crystal Structures & Defects

  • Cubic, hexagonal, and complex lattices
  • Point, line, and planar defects

12.20-13.10

Lunch Break

13.20-14.10

Mechanical & Physical Properties

  • Elasticity, plasticity, hardness
  • Thermal/electrical conductivity of metals

14.20-15.10

Binary Phase Diagrams

  • Fe–C and Ag–Cu equilibria
  • Liquidus, solidus, and lever rule applications

8/12

10.20-11.10

Annealing

  • Principles of recovery, recrystallization, and grain growth
  • Effects of temperature and time on microstructure

Presentation & Discussion

11.20-12.10

Quenching

  • Rapid cooling media (water, oil, polymer)
  • Martensite formation and residual stresses

12.20-13.10

Lunch Break

13.20-14.10

Tempering

  • Purpose of tempering martensitic steels
  • Influence of temperature/time on hardness and toughness

14.20-15.10

Effects on Properties

  • Correlation between heat treatments and mechanical properties (hardness, ductility, impact resistance)
  • Microstructural examples and case studies

8/13

10.20-11.10

Lead vs. Lead-Free Solders

  • Regulatory drivers and alloy choices
  • Comparative melting ranges and thermal properties

Presentation & Discussion

11.20-12.10

Solder Microstructure & Properties

  • Solidification microstructures (eutectic, dendritic)
  • Mechanical strength and conductivity

12.20-13.10

Lunch Break

13.20-14.10

Joint Reliability Testing

  • Thermal cycling, mechanical fatigue methods
  • Reliability metrics and standards

14.20-15.10

IMC Formation & Failure Mechanisms

  • Intermetallic layer growth kinetics
  • Common failure modes: cracking, voiding, delamination

8/14

10.20-11.10

Instructor Case Study (Part 1)

  • Background & objectives
  • Experimental setup and methodology

Presentation & Discussion

11.20-12.10

Instructor Case Study (Part 2)

  • Key results and data interpretation
  • Implications for electronic packaging

12.20-13.10

Lunch Break

13.20-14.10

Student Presentations

  • Groups A–C present their mini-reports (15 min each)

Examination

14.20-15.10

Student Presentations (Round 1)

  • Groups D–F present their mini-reports (15 min each)

15.30-16.20

Group Feedback & Reflection

16.30-17.20

Wrap-Up Discussion: Trends & Challenges in Electronic Packaging

 

瀏覽數:
友善列印